Overview
Supported IC partners and selection notes.
Partners
About MacroSilicon
MacroSilicon (MacroSilicon Technology Co., Ltd.) focuses on IC design with proprietary intellectual property, product engineering, software development, and system integration. The company provides overall solutions for multimedia signal processing, with products widely used in flat-panel display, intelligent terminals, high-speed rail and automotive, industrial control, broadcast and television, medical, and related fields.
Headquartered in Hefei, Anhui, MacroSilicon has established R&D centers in Shanghai, Suzhou, Chengdu, Beijing, and Silicon Valley (USA), with a product and technology promotion center in Shenzhen. Core team members have strong domestic and international IC design backgrounds, and key engineers bring nearly twenty years of experience in chip design, product development, and project implementation.
The company has been recognized as a National High-Tech Enterprise and National IC Design Enterprise, and has achieved ISO9001, ISO14001, and OHSAS18001 certifications. In 2015, MacroSilicon was listed on the National Equities Exchange and Quotation (NEEQ) (stock code: 832193).
Looking ahead, MacroSilicon continues to invest in core technology and market-driven innovation for high-performance chips and intelligent electronic control products.
About Gscoolink
Gscoolink (Gscoolink Microelectronics Technology (Beijing) Co., Ltd.) was founded in May 2014 and is headquartered in Zhongguancun Software Park, Beijing, with branches or agencies in Nanjing, Shenzhen, and Taiwan. The company develops high-performance, high-speed interconnect IC solutions and is recognized as a national specialized and innovative “Little Giant” enterprise. Its products serve professional AV (ProAV), commercial and gaming displays, consumer AV (PC peripherals and home theater), and automotive AV (smart cockpit and ADAS domains).
In 2019, Gscoolink was among the first in China to launch HD 2.0 routing, switching, and distribution IC families. It later introduced the GSV5100 series for long-reach transmission with light compression, and in November 2022 released HD 2.1 parts with up to 48 Gbps bandwidth. The portfolio now includes nearly one hundred parts covering bridge, extension, distribution, switching, routing, video processing, and transport across HD, DisplayPort, and USB interfaces.
Guided by the principle of “aiming for the peak while being the foundation,” Gscoolink provides stable, controllable ultra-HD long-distance interconnect solutions for system customers. Recent credentials include renewed Little Giant status (2025) and High-Tech Enterprise certification (2026).
About HiChip
HiChip (Zhuhai HiChip Semiconductor Co., Ltd.) was established in November 2018 and is headquartered in Zhuhai, Guangdong. The company specializes in multimedia SoC chip design and solution development, adopting the architectural concept of "computing-display separation + AI cloud rendering + edge display" to provide integrated cloud-display-device solutions for smart office, smart home, intelligent entertainment, autonomous driving, and related fields.
HiChip products are widely used in projectors, portable displays, screen mirroring devices, vehicle infotainment systems, VR/AR/XR wearables, commercial displays, and advertising terminals, with cumulative sales exceeding tens of millions of units. The H1500 chip was honored with the Outstanding Market Performance award at the 18th "China IC Awards." The company has been recognized as a national-level specialized and innovative "Little Giant" enterprise, a Zhuhai Unicorn Seed Enterprise, and a Zhuhai Gazelle Enterprise.
With nearly 100 employees and an R&D team accounting for over 80% of the workforce, core engineers come from globally leading IC design companies such as Huawei HiSilicon, Apple, and Allwinner. HiChip has established the Guangdong Haichi Engineering Technology Research Center for Intelligent Audio-Video Decoding Chip Design. Core technologies include AI Codec with super-resolution and frame interpolation, a self-developed hardware accelerator architecture, dual-core heterogeneous SoC design, and customized image enhancement algorithms.
The company follows an iterative strategy of "mass-producing one generation, developing the next, and researching the future," focusing on wired/wireless screen mirroring, automotive connectivity, mobile device linking, and dual-screen heterogeneous display, while continuously delivering ultra-high-definition audio-video decoding SoCs with industry-leading cost performance.
